NVIDIA and Cisco have announced plans for Ultra-Dense Small Form Factor Pluggable (USFP), a new high-density 400Gb/s-per-lane optical module designed to equip the hardware ecosystem for the next generation of AI factories using pluggable transceivers.
As AI models grow and inference demand expands, AI factories must connect more computing systems while managing network complexity, power and costs. Moving more data per watt and per switch helps operators make better use of their infrastructure in enterprise LAN Ethernet AI fabrics, while extending a deployment model proven at scale across multiple generations of data center networks. With USFP, customers can embrace next-generation optical technology and meet the performance demand of AI workloads without overhauling their data center infrastructure.
Comparable to an OSFP-sized module, it delivers 4x the bandwidth and front-panel bandwidth density, with approximately 1.3x the power efficiency versus 200 Gb/s-per-lane pluggable modules. This means AI builders can increase their compute scale within the same network footprint while decreasing networking’s share of the overall AI factory power budget.
A Hardware Ecosystem for Next-Generation AI Factories
NVIDIA and Cisco are collaborating with TE Connectivity and Amphenol to build USFP cages, connectors and modules, with additional partners expected to join. The shared form factor gives suppliers a common foundation for developing high-density pluggable infrastructure for 400Gb/s-per-lane fabrics to build a robust ecosystem for AI factory builders.
The collaboration builds on NVIDIA and Cisco’s existing work to ensure NVIDIA Spectrum-X Ethernet networking and Cisco Silicon One-based Ethernet networks work together seamlessly, simplifying AI infrastructure deployment for enterprises, neoclouds and sovereign clouds.
NVIDIA and Cisco plan to create an open industry specification for USFP through an upcoming community-led multi-source project.
